AIM to Highlight REL61 at the SMTA Silicon Valley Expo & Tech Forum


Reading time ( words)

AIM Solder is pleased to announce their participation at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place on November 29th, 2017 at Bestronics in San Jose, California. AIM will highlight their revolutionary REL61™ lead-free solder alloy, along with their full line of solder assembly materials.

REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically soldering performance, cost and durability. A low silver/low cost alloy, REL61 not only is more durable than SAC305, but has a wider process window than any low/no silver alloy on the market today. REL61 improves wave and selective soldering performance, addressing sluggish barrel fill issues common to other low/no silver alloys and eliminating costly alloy maintenance and analysis requirements.  Extensive testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance.  Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity.

AIM will also highlight its full line of advanced solder materials, including its solder paste, liquid flux and solder alloys, including its newly developed REL22™ solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at the SMTA Silicon Valley Expo & Tech Forum for more information.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share

Print


Suggested Items

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

Who’s the Best of the Best in Hand Soldering?

01/11/2019 | Nolan Johnson, I-Connect007
IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.



Copyright © 2019 I-Connect007. All rights reserved.