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The Surface Mount Technology Association (SMTA) is inviting the industry to submit abstracts for the 2018 SE Asia Technical Conference on Electronics Assembly, which will be held on May 8–10, 2018, in Kuala Lumpur, Malaysia.
Co-located with Semicon Southeast Asia, the South East Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues.
Presentations and course abstracts are being sought in the following key technology tracks:
- Contract Manufacturing
- 3D Package Integration
- Advanced Integrated Systems and Devices
- Wafer-Level Packaging
Abstracts are due January 15, 2018, and papers and presentations will be due April 7, 2018.