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As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Paper, Best of Proceedings Paper, and the Best International Paper.
The winners from SMTA International 2006 are David Hillman and Ross Wilcoxon of Rockwell Collins for Best of Conference for their work entitled "JCAA/JG-PP Lead Free Solder Testing for High Reliability Applications;" Robert Darveaux of Amkor Technology for Best of Proceedings for his paper "Mechanical Testing of Solder Joint Arrays Versus Bulk Solder Specimens;" and Heather McCormick of Celestica, Inc., for Best International Paper for her paper entitled "Mixing Metallurgy: Reliability of SAC Balled Area Array Packages Assembled Using SnPb Solder."
The authors will formally be presented their awards at the SMTAI Opening Ceremony during SMTA International 2007 in Orlando, Florida. For information on participating in the 2007 SMTA International Conference, visit the Call for Papers page of the event Web site at smta.org/smtai, or contact SMTA administrator JoAnn Stromberg at 952-920-7682 or email@example.com. Abstracts can be uploaded directly on-line and will be accepted through February 2, 2007.
The papers are available in the conference proceedings available in the SMTA Bookstore at
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.