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ASM Assembly Systems will highlight its total solutions from back-end equipment to SMT equipment at the Internepcon Japan 2018, which will be held on January 17–19, 2018 at the Tokyo Big Sight. ASM will be in Booth E12-48.
This is the first time ASM will be showcasing its wide range of total factory solutions together. There will be exhibition of various platforms such as ASM Automatic Die Bonding System AD210 and AD832i; ASM SMT high-end printing and placement platforms DEK NeoHorizon iX and SIPLACE TX2i; and the mid-speed placement platform E by SIPLACE.