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ASM Assembly Systems will highlight its total solutions from back-end equipment to SMT equipment at the Internepcon Japan 2018, which will be held on January 17–19, 2018 at the Tokyo Big Sight. ASM will be in Booth E12-48.
This is the first time ASM will be showcasing its wide range of total factory solutions together. There will be exhibition of various platforms such as ASM Automatic Die Bonding System AD210 and AD832i; ASM SMT high-end printing and placement platforms DEK NeoHorizon iX and SIPLACE TX2i; and the mid-speed placement platform E by SIPLACE.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Stefan Härter, et al.
The ongoing miniaturization trend in the SMT production induces new challenges and highly integrated systems. In passive components, the miniaturization leads to the introduction of the EIA size 01005 or smaller. Despite numerous publications in this field already addressing the printing of such devices, a defined wholly optimized process remains unsolved and inspires further novel research ideas on this topic.
Co-sponsored by ASM Assembly Systems, with active participation from Koh Young Technology and Rehm Thermal Systems, Technica USA's Annual Technology Forum Event held last July 22–23 in San Jose, California, was again a success. The event featured technical presentations and demonstrations on stencil printing, SPI, SMT placement defects, as well as the challenge in complex boards with 03015 parts up to large components.