IPC Technical Webinar Tackles Surface Analytics and Quicktests


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How clean is clean? When manufacturing electronic assemblies, impurities left on the board’s surface or underneath the components may lead to in-field failures. To shed light on this issue, IPC will be holding a technical webinar on 23 January 2018 to provide an overview of methodologies available to properly assess the cleanliness of your post clean assemblies.

Topics for discussion include surface analysis for cleanliness assessment; measurement of standards demands; use of analysis processes in the production line; and handling of analysis tools for quality control of supplied components.

The webinar will be led by Dr. Helmut Schweigart, head of the technology department at Zestron.

For more information or to register, click here.

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