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How clean is clean? When manufacturing electronic assemblies, impurities left on the board’s surface or underneath the components may lead to in-field failures. To shed light on this issue, IPC will be holding a technical webinar on 23 January 2018 to provide an overview of methodologies available to properly assess the cleanliness of your post clean assemblies.
Topics for discussion include surface analysis for cleanliness assessment; measurement of standards demands; use of analysis processes in the production line; and handling of analysis tools for quality control of supplied components.
The webinar will be led by Dr. Helmut Schweigart, head of the technology department at Zestron.
For more information or to register, click here.
Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Stephen Las Marias, I-Connect007
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.