VJ Electronix to Demo Enhancements to Rework and X-ray Products at IPC APEX EXPO 2018


Reading time ( words)

VJ Electronix Inc. will demonstrate the latest enhancements to its rework and X-ray product lines at the IPC APEX EXPO 2018, which is scheduled to take place February 27–March 1, 2018 at the San Diego Convention Center. The company will be in Booth 2551.

The revolutionary XQuik II with AccuCount Technology is now faster than ever. With available material handling automation, the XQuik system automatically counts components at up to twice the original speed. Parallel processing allows the system to acquire images and calculate component count in parallel with bar code scan, loading and labeling of reels.

The Summit 1800i is an improved version of the world’s most popular rework system. VJE has maintained all of the benefits of high efficiency convection heating and the renowned 1-2-3-Go interface, coupled with updated technology for greater reliability and an improved price point. Further refinements enhance the system’s performance with ultra - small components like 01005s, while maintaining its capabilities with large boards, oversized CPU sockets, connectors and large BGAs.

Also on display, the popular Micra is designed for rework of smaller, high performance components, such as Chip Scale Packages (CSP), Package on Package (PoP) and Micro Passives (01005). The enhanced Micra provides a larger 35 mm alignment field of view and an optional full travel programmable X-Y motion, expanding its range of applications and allowing greater automation for pallets and multi-up trays.

VJE’s new High Capacity Scavenger provides high throughput, non-contact solder removal. With a variety of larger tips and an increased volume solder trap, site dressing time is drastically reduced while time between maintenance is extended. The increased capacity is ideal for large BGAs, CPU Sockets and column grid arrays. Special tips are available to support bulk removal of passive devices and LEDs.

About VJ Electronix

VJ Electronix, Inc. manufactures production ready, automated Rework and X-ray inspection systems with many advanced capabilities. The company frequently provides custom solutions tailored to satisfy specific application requirements. VJ Electronix is a worldwide leader in X-ray Inspection and Rework equipment.

For more information, click here

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.