Indium Technical Support Engineer Presents at SMTA Space Coast


Reading time ( words)

Indium Corporation Technical Support Engineer Kim Flanagan shared her expertise at the SMTA Space Coast Expo & Tech Forum on January 18 in Melbourne, Florida.

Flanagan’s presentation, Solder Preforms—New Applications, New Shapes, and All New Ideas, detailed the versatility of the solder preform, including unique characteristics that enable multiple functionalities and an endless variety of applications in numerous industries.

Flanagan provides technical support and guidance related to process steps, equipment, techniques, and materials to customers. In addition, she delivers technical training to staff and industry partners. Flanagan was introduced to Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in Physics from Le Moyne College in December 2016.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

Northrop Grumman: 3D Nanomaterials May Counter Gaps in Additive Supply Chain

10/22/2020 | Andy Shaughnessy, Design007 Magazine
The best technology is dead in the water if your domestic supply chain won’t support it. That was just one of the takeaways from Dr. Judy Dickson’s talk during the SMTA Additive Electronics TechXchange. In her presentation, titled “Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain,” Dickson, a senior principal systems engineer at Northrop Grumman Mission Systems, laid out the many challenges her department faces in fielding HDI advanced packaging into the next decade. Most of these challenges are related to sourcing the necessary materials in the U.S.

Increase Traceability, Prevent Counterfeiting

08/25/2020 | I-Connect007 Editorial Team
Michael Ford, senior director of emerging industry strategy for Aegis Software and I-Connect007 columnist, speaks about the increasing importance of traceability in manufacturing and throughout the supply chain, including how it affects such areas as counterfeit components and inventory management.

The iNEMI 2019 Board Assembly Roadmap

06/01/2020 | Pete Starkey, I-Connect007
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.



Copyright © 2020 I-Connect007. All rights reserved.