MIRTEC to Exhibit 3D AOI and SPI Systems at IPC APEX EXPO 2018


Reading time ( words)

MIRTEC will premier its complete line of 3D AOI and SPI systems at the IPC APEX EXPO 2018. The premier technical conference and exhibition for the electronics manufacturing industry will take place February 27-March 1, 2018 at the San Diego Convention Center in California. MIRTEC will be in Booth 1327.

"We are very excited about the products that we will be presenting at IPC APEX EXPO 2018," stated Brian D'Amico, president of MIRTEC's North American Sales and Service Division. "MIRTEC will feature a total of seven 3D inspection systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry." 

The award-winning MV-6 OMNI 3D AOI machine is configured with MIRTEC’s exclusive OMNI-VISION 3D Inspection Technology which combines 15 Mega Pixel CoaXPress Camera Technology with the revolutionary Digital Multi-Frequency Quad Moiré 3D system in a cost effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured for use with MIRTEC's complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC MV-6 OMNI machines feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology has set the standard by which all other inspection equipment is measured. MIRTEC will have two MV-6 OMNI’s on display one configured with a 10um lens for high-performance applications and the other with a 15um lens for high-speed applications.

New to IPC APEX EXPO 2018 is the MV-6 OMNI configured with the company's prototype OMNI-VISION 2.0 3D Inspection Technology. This revolutionary 3D technology combines MIRTEC’s proprietary 15 Mega Pixel Top-Down CoaXPress Camera with a total of eight Digital Multi-Frequency Moiré 3D Projectors. Each projector is capable of projecting frequencies effectively “Leap-frogging” the competition with the ability to capture up to ninety-six (96) 3D images per inspection frame. Fully configured, the system features four 18 Mega Pixel Side-View Cameras in addition to the 15 Mega-Pixel CoaXPress Top-Down Camera. 

MIRTEC’s award-winning MS-11e 3D SPI machine is configured with an exclusive 15 Mega Pixel CoaXPress Camera System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.

The MS-11e uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

MIRTEC will have two MS-11e’s on display one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.

MIRTEC’s Award Winning MV-3 OMNI Desktop 3D AOI Machine is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION 3D Inspection Systems providing 100% compatibility across MIRTEC’s entire 3D AOI product line. These systems feature MIRTEC’s exclusive OMNI-VISION 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed desktop platform.  MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with the complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology, provides true 3D inspection using a total of four Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-3 OMNI machine features four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine in the world! MIRTEC will have two MV-3 OMNI’s on display one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.

MIRTEC’s total quality management system software, INTELLISYS® will also be on display at the IPC APEX EXPO. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.

"MIRTEC continues to set new standards within the highly competitive Electronics Inspection Industry," continued D’Amico. "These revolutionary products provide unprecedented 3D inspection performance and the industry’s lowest cost of ownership making them an ideal solution for electronics manufacturing companies of all sizes.  We look forward to welcoming visitors to our Booth #1327 during the three-day event."

About MIRTEC

MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please click here.

Share


Suggested Items

MacDermid Enthone to Exhibit and Present at Hong Kong Printed Circuit Association Show 2018

11/21/2018 | MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.

Survey: Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.



Copyright © 2018 I-Connect007. All rights reserved.