Best Technical Paper at IPC APEX EXPO 2018 Selected


Reading time ( words)

The best technical conference paper of IPC APEX EXPO 2018 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 27.

Taking top honors, the winning paper is, “Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils” by Marina Y. Koledintseva, Oracle. Her co-author was: Tracey Vincent, CST of America. This paper will be presented during Technical Conference Session 16 (PCB Signal Integrity/High Speed/High Frequency) on Wednesday, February 28.

This year, two papers were selected in the honorable mention category. Honorable mention went to, “Derivation of Equation on Thermal Life Prediction of Plated Through-Hole for Printed Wiring Board” by Yoshiyuki Hiroshima, Fujitsu Advanced Technologies Limited. His co-authors were: Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies Limited; Yoshiharu Kariya and Kazuki Watanabe, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Company, Ltd.; and Jack Tan, HDP User Group International, Inc. This paper will be presented during Technical Conference Session 12 (PCB Reliability) on Wednesday, February 28.

Honorable mention also goes to “Bottom Heating during Manual Rework” by Lars Bruno, Ericsson AB. This paper will be presented during Technical Conference Session 20 (Rework) on Wednesday, February 28.

The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, click here.  

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share


Suggested Items

Is There an End in Sight to the Electronic Components Crisis?

07/12/2018 | Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.

It’s Time to Retire ROSE Testing

06/27/2018 | Joe Russeau, Precision Analytical Laboratory, and Mark Northrup, IEC Electronics
Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.

RTW IPC APEX EXPO: How Smart Factories Will Revolutionize Electronics Manufacturing

03/07/2018 | Real Time with...IPC
KIC president Bjorn Dahle discusses the smart manufacturing trend in the electronics assembly industry, and how KIC can help their customers with smart manufacturing transitions.



Copyright © 2018 I-Connect007. All rights reserved.