Nordson YESTECH to Showcase New Dual-Sided PTH AOI Solution at IPC APEX 2018


Reading time ( words)

Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coating inspection systems for the electronics industry, will feature the new high speed FX-942 dual sided PTH automated optical inspection system for populated printed circuit boards, at the annual APEX 2018 show held at the San Diego Convention Center, in San Diego, California from February 26th to March 1st. They will conduct live demonstrations in the booth of their complete line of AOI and Conformal Coating inspection systems.

Nordson YESTECH’s FX-942 dual sided AOI system is ideally suited to inspect the unique challenges of plated through hole (PTH) assemblies, offering high-speed inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly in pre-wave or post-wave applications. The FX-942 ideally complements Nordson SELECT’s Selective Soldering systems providing inspection capabilities for demanding soldering applications.

Programming the FX-942 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-942 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.

The FX-942 saves valuable inspection time, delivering a complete, high-speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts featuring:

  • Dual sided imaging with full travel imaging sensors
  • 1 vertical and 4 optional angle cameras per side
  • Up to 100 mm clearance
  • High speed inspection and transfer
  • High defect coverage / low false failure
  • Picture in Picture (P-in-P) feature
  • MES / Industry 4.0 compatible

The FX-942 is highly effective for selective solder, post-wave and connector inspections, enabling users to improve quality and enhance yields. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

“We are very pleased to once again be exhibiting our latest inspection solutions at APEX 2018,” said Don Miller, Nordson YESTECH Vice President. “APEX is the ideal opportunity to meet with our valued customers and demonstrate YESTECH’s latest advancements in AOI. The FX-942 is yet another example of new inspection technology from Nordson YESTECH and we look forward to discussing the many benefits

About IPC Printed Circuits Expo, APEX 2018

The electronics industry’s own event – a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need. For more information about IPC Printed Circuits Expo. APEX 2018 and to register, click here.

About Nordson YESTECH

Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly  and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, click here.

About Nordson Corporation 

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces.  These products are supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.

Share


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.



Copyright © 2018 I-Connect007. All rights reserved.