SMTA Announces Upcoming Webtorials and Webinars

Reading time ( words)

The Surface Mount Technology Association (SMTA) has announced several new online presentations coming up this year. In an effort to maximize accessibility, SMTA is committed to providing high quality online programming to better accommodate member needs for technical exchange.

Webtorials are two-part (90 minutes each part) online presentations that provide more depth on a subject and are comparable to half-day professional development courses. Webinars are one session lasting 60 to 90 minutes covering general concepts.

2018 Webinar Offerings

Electronics in Harsh Environments
Tuesday, March 6 (9:30am-10:30am Eastern)
Presented by: Keith Bryant, Yxlon International and SMTA Europe

Solder Paste Qualification Testing
Wednesday, March 7 (1:00pm-2:30pm Eastern)
Presented by: Chrys Shea, Shea Engineering and Doug Dixon, Henkel Electronic Materials

2018 Webtorial Offerings

Role of Bi in Lead-free Electronics – All You Need to Know
Wednesday, March 14 and Thursday, March 15 (1:00pm-2:30pm Eastern)
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

Stencil Printing Process and Solder Paste Inspection – An In-Depth Look
Wednesday, April 18 and Thursday, April 19 (1:00pm-2:30pm Eastern)
Presented by: S. Manian Ramkurar, Ph.D., Rochester Institute of Technology

Tin Whisker – All You Should Know
Thursday, May 17 and Friday, May 18 (1:00pm-2:30pm Eastern)
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly
Thursday, June 14 and Friday, June 15 (1:00pm-2:30pm Eastern)
Presented by: S. Manian Ramkurar, Ph.D., Rochester Institute of Technology

Fan Out Packaging – Technology Overview and Evolution
Tuesday, July 17 and Wednesday, July 18 (1:00pm-2:30pm Eastern)
Presented by: John Hunt, ASE (US) Inc.

More 2018 topics to be announced.

About SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.


Suggested Items

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

The Root Causes & Solutions for Warped PC Boards

09/27/2017 | Duane Benson, Screaming Circuits
There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues. If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.

X-Ray Inspection of Lead and Lead-Free Solder Joints

07/31/2017 | Glen Thomas, Ph.D., and Bill Cardoso, Ph.D., Creative Electron Inc.
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?

Copyright © 2018 I-Connect007. All rights reserved.