SMTA Announces Upcoming Webtorials and Webinars


Reading time ( words)

The Surface Mount Technology Association (SMTA) has announced several new online presentations coming up this year. In an effort to maximize accessibility, SMTA is committed to providing high quality online programming to better accommodate member needs for technical exchange.

Webtorials are two-part (90 minutes each part) online presentations that provide more depth on a subject and are comparable to half-day professional development courses. Webinars are one session lasting 60 to 90 minutes covering general concepts.

2018 Webinar Offerings

Electronics in Harsh Environments
Tuesday, March 6 (9:30am-10:30am Eastern)
Presented by: Keith Bryant, Yxlon International and SMTA Europe

Solder Paste Qualification Testing
Wednesday, March 7 (1:00pm-2:30pm Eastern)
Presented by: Chrys Shea, Shea Engineering and Doug Dixon, Henkel Electronic Materials

2018 Webtorial Offerings

Role of Bi in Lead-free Electronics – All You Need to Know
Wednesday, March 14 and Thursday, March 15 (1:00pm-2:30pm Eastern)
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

Stencil Printing Process and Solder Paste Inspection – An In-Depth Look
Wednesday, April 18 and Thursday, April 19 (1:00pm-2:30pm Eastern)
Presented by: S. Manian Ramkurar, Ph.D., Rochester Institute of Technology

Tin Whisker – All You Should Know
Thursday, May 17 and Friday, May 18 (1:00pm-2:30pm Eastern)
Presented by: Jennie S. Hwang, Ph.D., H-Technologies Group

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly
Thursday, June 14 and Friday, June 15 (1:00pm-2:30pm Eastern)
Presented by: S. Manian Ramkurar, Ph.D., Rochester Institute of Technology

Fan Out Packaging – Technology Overview and Evolution
Tuesday, July 17 and Wednesday, July 18 (1:00pm-2:30pm Eastern)
Presented by: John Hunt, ASE (US) Inc.

More 2018 topics to be announced.

About SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.