CyberOptics’ MRS-Enabled SE3000 3D SPI Receives NPI Award

Reading time ( words)

CyberOptics Corporation today announced that it has been awarded a 2018 NPI Award in the category of Test and Inspection – SPI for its SE3000 Solder Paste Inspection (SPI) system. The award was presented to the company during a Tuesday, February 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

The new SE3000 SPI system is the very first SPI system to incorporate the industry-leading Multi-Reflection Suppression (MRS) sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits and 0201 metric components. Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.

cyber2.jpg“We are very honored to receive the sixth award related to our proprietary MRS sensor technology, now integrated into our SE3000 SPI system,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “MRS technology has been delivering unprecedented inspection results that drives yield improvements for our customers with the most challenging requirements – for 3D AOI, metrology, semiconductor and now 3D SPI.”

SE3000 fully supports feedback and feed forward capability with leading Solder Paste Printer and SMT Mounter vendors respectively. SE3000-DD Dual lane, Dual sensor and SE3000-X for large board capability also are available. With simple configuration settings, SE3000 gives you the power to do more with SPI results - optimize printing process, establish stencil cleaning cycles and fine-tune printer setup. All of this means reduced rework costs, increased production throughput and improved yields.

About CyberOptics

CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

For more information, click here.   


Suggested Items

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

RTW IPC APEX EXPO: Developments and Reliability Improvements in Solder Alloys

03/01/2018 | Real Time with...IPC
Tim O'Neill explains developments in solder alloys for cost-sensitive applications, and improvements in the reliability of alloys subjected to sustained high temperatures.

Copyright © 2018 I-Connect007. All rights reserved.