Indium’s Sandy-Smith Earns IPC Distinguished Committee Service Awards at IPC APEX EXPO 2018


Reading time ( words)

Indium Corporation’s Brook Sandy-Smith, technical support engineer for PCB Assembly Materials, was recognized with two Distinguished Committee Service Awards from IPC at the IPC APEX EXPO on Wednesday, February 28 in San Diego, California.

The Distinguished Committee Service Awards recognized Sandy-Smith’s contributions to the development of Amendment 1 to IPC J-STD-006C, requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications, and her contributions to the 2017-2018 Technical Program Committee.

Brook Sandy-Smith is a technical support engineer based at Indium Corporation’s global headquarters in Clinton, New York and a leader in the industry for technical knowledge and support. Specializing in PCB assembly materials, she works closely with customers to develop custom solutions to optimize their processes. Sandy-Smith is an SMTA Certified Process Engineer and has a passion for developing and implementing standardized test methods. She is an active member of several IPC committees, SMTA programs, and iNEMI projects, and is currently serving as chair of the J-004 committee and Vice President of technical programs for the SMTA Empire chapter. Sandy-Smith graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.