Indium's Minter to Present at TMS 2018 Annual Meeting & Exhibition


Reading time ( words)

Indium Corporation’s Jonathan Minter, Research and Development Metallurgy Technician, will present at the TMS 2018 Annual Meeting & Exhibition on March 11-15 in Phoenix, Arizona.

High-Pb solders have been used as die-attach materials for decades in discrete power packages. Due to the known harmful effects of Pb to human health and the environment, and the demand of SiC power device serving under higher junction temperature, alternative Pb-free materials have been studied intensively. However, Pb-free alternatives for die-attach applications are still in the infant age, and no well-recognized drop-in solution is available yet.

Minter’s presentation, "High Temperature Lead-free Die Attach Materials," will review the potential materials/technologies for high-temperature Pb-free die-attach, including solders, sintering materials, and solid-liquid interdiffusion materials/technology.

Minter joined Indium Corporation in 2015 and is responsible for supporting the development and testing of high-temperature Pb-free solder paste alloys. He earned a bachelor’s degree in chemistry and a master’s degree in chemistry (adolescence education) from SUNY Cortland.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.