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The main event of the 2018 spring program of SMTA Europe will be the Conference in Amsterdam, The Netherlands, on April 24-26, on the theme of Electronics in Harsh Environments.
SMTA Europe Technical Committee member Bob Willis presented a webinar on March 6, in which he was joined by SMTA Europe Chairman Keith Bryant to give a preview of the conference program and some of its highlights.
A video of the webinar can be viewed here.
Bryant explained that the UK-based SMART Group was now fully integrated into SMTA as SMTA Europe, and that the Harsh Environments conference builds on the success of last year’s highly popular SMART/SMTA Contamination, Cleaning and Coating Conference.
This year’s event features leading authorities from the electronics industry and research institutions, and is organised over three days, with the option to attend two professional development courses on April 24: Reliability Assessment of Harsh Environmental Electronics led by Martin Wickham from National Physical Laboratory, and Understanding Shock & Vibration, led by Dr. Alec Feinberg from DfR Software.
The two-day technical program commences on April 25, with sessions on predicting component life, a keynote on high power LED solder joint reliability, with parallel afternoon sessions on reliability of solder alloys and electrochemical reliability on one track, and advanced test methods and adhesion and coating on the other.
The second day’s technical program has morning sessions on automotive environments and high-temperature PCB materials and fabrication. The afternoon features joint SMTA-iNEMI interactive forum with an introductory presentation on the IPC-610 Automotive Addendum followed by a panel discussion on meeting the needs of durability for autonomous vehicle electronics, with breakout groups on designing automotive electronics for use in harsh environments, robustness validation for mission profiles, the zero-defect target for autonomous vehicles, practical sustainability and environmental regulations, and miniaturization and systems integration challenges.