Alpha Intros Low-Temp Solder Paste at productronica China 2018


Reading time ( words)

Alpha Assembly Solutions will be introducing its new low temperature solder paste at productronica China in Shanghai from March 14-16, 2018. 

Alpha's revolutionary ALPHA OM-550 HRL1 low temperature, high reliability solder paste will be highlighted at the show. The ALPHA HRL1 alloy was designed to improve thermal cycling performance in low temperature assemblies. The chemistry and alloy pairing is revolutionary as it reduces the soldering temperature required for SAC alloys by 50°C, while dramatically reducing power consumption and carbon emissions.  The ALPHA HRL1 alloy enables assemblers to have a cost efficient, highly reliable soldering process with up to 99% less warpage and significantly fewer defects. It shows the best compatibility with SAC alloys vs. other low temperature SnBi alloys.

Additionally, ALPHA OM-550 has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures, therefore minimizing Head-in-Pillow and NWO defects in complex assemblies.

For more information on Alpha’s low temperature solder paste, visit Alpha Assembly Solutions Booth at Productronica China E2-2140.

About productronica China

productronica China is one of the leading platforms for innovative electronics manufacturing shows.  It gathers leading exhibitors of electronics production in all industrial sectors, like SMT, electronic manufacturing automation, motion control, cable processing, connector and component manufacturing, dispensing, soldering tools and materials, PCB and EMS. For more information, click here.

Date: March 14-16, 2018
Venue: Shanghai New International Expo Centre, 2345 Longyang Road, Pudong New Area Shanghai P.R.C.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

Share


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.



Copyright © 2018 I-Connect007. All rights reserved.