AIM to Highlight REL61 and REL22 at SMTA West Penn Expo

Reading time ( words)

AIM Solder announces their participation at the SMTA West Penn Expo & Tech Forum, scheduled to take place March 28th, 2018 at the DoubleTree Monroeville Hotel in Monroeville, Pennsylvania. AIM will highlight their revolutionary REL61 and award-winning REL22 lead-free alloys along with their full line of solder assembly materials.

REL61 was developed to provide PCB assemblers and designers with an enhanced reliability, cost-effective replacement for SAC305 and other low/no silver alloys. REL61 outperforms all common lead-free alloys in durability, wetting performance, thermal cycling performance, and BTC void performance.  Available in paste, wire and bar solder formats, REL61 can be incorporated into all phases of PCB assembly. 

AIM will also highlight its full line of advanced solder materials, including its solder paste, liquid flux solder alloys, and its newly developed and award-winning REL22 solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at the SMTA West Penn Expo & Tech Forum for more information.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.


Suggested Items

Cleaning with Data

03/19/2018 | Barry Matties, I-Connect007
Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company's focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

Copyright © 2018 I-Connect007. All rights reserved.