SMTA SE Asia Technical Conf on Electronics Assembly Program Finalized


Reading time ( words)

SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.  

Professional Development Courses will be held on Tuesday, May 8. In the morning, AF Ng, Techment Consultancy Sdn. Bhd., will instruct the course, “Understanding Parameters Affecting Barrel Fill in Wave Soldering Process.” In the afternoon, John Lau, Ph.D., ASM, will instruct the course, “Flip Chip, WLCSP, and FOWLP Assembly and Reliability.”

Session topics for May 9 and 10 include: Design, Manufacturing and Assembly Rework; Conformal Coating and Product Reliability; Inspection and Quality; Big Data and Manufacturing Considerations; Paste Printing and Soldering; Cleaning Challenges for Board Assemblies and Harsh Environments; and Advanced Packaging.

The SE Asia Technical Conference on Electronics Assembly Technology is co-located with SEMICON Southeast Asia, in partnership with SEMI and supported by Persatuan Surface Mount Technology P. Pinang.

About SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.

Share


Suggested Items

What's the Scoop? APEX CFX Showcase

05/03/2018 | Philip Stoten, Scoop
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.

RTW IPC APEX EXPO: COMET Technologies Highlights Product Range and New Facility

03/12/2018 | Real Time with...IPC
Craig Arcuri of COMET Technologies details the numerous ways his company's technology is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades. He also speaks about Lab One, the company's new technology and application center in Silicon Valley.

Mycronic Announces the Acquisition of Vi TECHNOLOGY

02/21/2018 | Barry Matties, I-Connect007
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.



Copyright © 2018 I-Connect007. All rights reserved.