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SMTA Europe has announced Keynote Speaker Ralph Tuttle of Cree Inc. on High Power LED Solder Joint Reliability at the "Electronics in Harsh Environments Conference" to be held in Amsterdam, Netherlands, on April 25, 2018.
Advances in LED technology now allow operation at much higher temperatures while still achieving high lumen output and long lifetimes. While traditional lead-free SAC 305 solder alloys are acceptable for LEDs operating in benign conditions, they are not as reliable when LEDs are operated at high temperatures since they drive high currents. This talk will discuss failure modes associated with LEDs operating under stressful conditions. The research into alloy modifications to package construction will be presented.
Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.
T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.
Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.