ZESTRON Academy to Host Free Defluxing Advanced Packages Webinar


Reading time ( words)

ZESTRON is pleased to announce that it will host the “Defluxing Advanced Packages” webinar on Thursday, April 26, from 1:30 PM to 2:30 PM EDT. This is the second installment of the ZESTRON Academy 2018 Cleaning Webinar Series, and will be presented by Senior Application Engineer, Ravi Parthasarathy, M.S.Ch.E.

In order to increase power module yield and reliability, companies are developing new power packaging products targeting the common failure locations, die and substrate attach, interconnection and encapsulation. This has resulted in increased performance requirements involving greater packaging density and various material mix. This webinar provides an overview of potential failures that one can expect by selecting an inappropriate chemistry and addresses important factors to be considered when selecting an optimum cleaning agent.

“We invite both new and experienced industry members to attend this free webinar as we’ll review how newly improved cleaning agent formulations provide superior material compatibility and cleanliness ensuring high reliability for advanced packages,” said Sal Sparacino, Sales and Marketing Manager, ZESTRON Americas.

For more information or to register for this free webinar, visit here.

About ZESTRON:

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please click here.

Share


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Interview with Linda Woody: Dieter Bergman IPC Fellowship Award Recipient

04/04/2018 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. This year, Linda Woody is one of the two recipients of the award. Here's what she has to say.

RTW IPC APEX EXPO: Kyzen’s Tom Forsythe Talks Tips for Better Cleaning

03/28/2018 | Real Time with...IPC
Tom Forsythe, executive VP of KYZEN, offers his advice on designing for better cleaning. Forsythe also discusses customers' continuing demand for data and KYZEN's data management efforts.



Copyright © 2018 I-Connect007. All rights reserved.