-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium to Present at SMTA China East Technology Conference 2018
April 19, 2018 | Indium CorporationEstimated reading time: 1 minute
Three Indium Corporation experts will share their expertise at the SMTA China East Technology Conference 2018 on April 23-26 in Shanghai, China.
Research Chemist Fengying (Alice) Zhou will present Fluxes Effective in Suppressing Non-Wet-Open at BGA Assembly, This presentation will detail various flux solutions that address the challenge of non-wet opens that result from the continuing trend toward miniaturization.
Evan Yin, Assistant Manager – Simulation Lab in Suzhou, China, will present Differences Between SMD and NSMD in the SMT Process. This presentation includes the distinctions between the two kinds of PCB pad designs, solder mask define (SMD) pad and non-solder mask define pad (NSMD).
Research Chemist Mary Ma will present Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175°C, which reviews the testing results of a novel lead-free solder alloy under harsh conditions.
Zhou joined Indium Corporation in 2010 and is based in Suzhou, China. She is responsible for developing SMT assembly solder materials. Additionally, she provides support to the global R&D team. Zhou earned her bachelor’s degree in applied chemistry and her master’s degree in inorganic chemistry from Suzhou University.
Yin joined Indium Corporation in 2017. He is responsible for equipment engineering at Indium Corporation’s Suzhou Process Simulation Lab. He provides technical support and services, such as product and process recommendations, troubleshooting, conducting product evaluations and qualifications. Before joining Indium Corporation, Yin worked in the surface mount technology field for more than 15 years. He has a degree in computer information management from Soochow University.
Ma joined Indium Corporation in 2010 and is based in Suzhou, China. She is responsible for developing halogen-free, lead-free, and no-clean flux chemistries with low voiding. Ma earned her bachelor’s degree in Chemistry from Qufu Normal University and her master’s degree in Physical Chemistry from Nanjing University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.