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Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding. Other key topics discussed include their integrated software and their Industry 4.0 strategy.
Watch the interview here.
By A. Lifton, P. Salerno, J. Sidone and O. Khaselev, Alpha Assembly Solutions
Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.
Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.
Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.