Reading time ( words)
At the recent IPC APEX EXPO 2018 conference and exhibition in San Diego, California, Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.
Watch the interview here.
Stephanie Weaver, Zentech Manufacturing Inc.
To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.
Patty Goldman, I-Connect007
I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.
Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.