NASA Technology Managers Visit TopLine at Space Tech Expo


Reading time ( words)

Members of the NASA Technology Licensing and Commercialization Team visited the TopLine exhibit at the recent 2018 Space Tech Expo show in Pasadena, California, USA, where they awarded a NASA lapel pin to TopLine CEO Martin Hart in appreciation of TopLine’s efforts to develop a business model around PID (Particle Impact Damper) technology. PID cancels random vibrations in PCB printed circuit board assemblies, reducing the potential for damage in harsh environments and is especially suited to applications in the mil-aero defense industry.

TopLine’s innovative PID vibration cancellation particle damping technology was originally developed by NASA, which entered into a License Transfer agreement in 2016 with TopLine to manufacture and commercialize the PID patent. TopLine’s PID were invented at NASA’s Marshall Space Flight Center.

“PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field,” states Martin Hart. “After hardening, old hardware is ready for new missions in new operating environments.” The PID surface mounts onto the PC Board. Inside the PID is a payload of freely-moving tungsten balls that move in the opposite direction to the board. This counter motion pulls back the bending of the board and attenuates vibrational energy. PID technology operates over a full range of temperatures without de-rating. PIDs can be attached like ordinary components. Readers are encouraged to visit a new web site showing a two-minute YouTube video how the PID works. Please click here.

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. 

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.