Indium Engineers Earn Lean Six Sigma Green Belt Certification


Reading time ( words)

Indium Corporation has announced that three company engineers have earned their designation as Lean Six Sigma Green Belt-certified. With their recent designation, Daniel Siedsma, Chemical Process Engineer; Adam Murling, Technical Support Engineer; and Michael Wood, Manufacturing Process Engineer, join a number of employees who are Lean Six Sigma certified at Indium.

Lean Six Sigma is a business approach that focuses on improving workplace performance by reducing waste and process variations. The certification process involves two weeks of training that culminates in an examination in statistics, designed experiments, statistical process control, and "lean" continuous improvement concepts.

Daniel_Siedsma.jpgSiedsma joined Indium in 2011 as a chemical process engineer and performs research and development with Indium's metals and compounds products. He earned his bachelor's degree in chemical engineering from Rensselaer Polytechnic Institute (RPI) with a minor in general psychology.

Adam_Murling.jpgMurling joined Indium in 2014 as a technical support engineer. He is responsible for providing leading-edge technical support for Indium's global account initiatives through SMT process optimization, material recommendations, and customer training. He is an active blogger and has authored numerous technical papers. He earned his bachelor's degree in chemical engineering from Clarkson University.

Michael_Wood.jpgWood joined Indium in 2017 as a manufacturing process engineer working with Indium's engineered solder products. He earned his bachelor's degree in mechanical engineering technology from the State University of New York Polytechnic Insitute.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm

02/14/2020 | I-Connect007 Editorial Team
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies. Further, there are challenges associated with soldering. How do we go away from traditional soldering technologies or methodologies where these devices are so complex that warpage or alloy or reliability is driving us into unknown territories with soldering methodologies?

LPKF on Stencils and Depaneling

02/11/2020 | I-Connect007 Editorial Team
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.

Clean vs. No-clean: A Generational Difference

12/24/2019 | Barry Matties, I-Connect007
Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.



Copyright © 2020 I-Connect007. All rights reserved.