ASM Placement Platform Features Major Improvements


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ASM Pacific Technology Ltd is pushing the envelope to the limit by presenting a new version of its SIPLACE TX placement modules that features major improvements. Equipped with the new SpeedStar head, the new model's placement performance has been increased by another 23 percent to around 96,000 cph (components per hour), while its component spectrum now ranges from 0201 (metric) to 8.2 x 8.2 mm. The new model also reduces power consumption and has a planned long-board option for boards with lengths of up to 510 mm.

ASM's developers also installed a component camera with improved resolution and larger vision field, better component sensors, and a more robust contactless data and power transmission system. Despite the significant speed increase, the new SIPLACE TX still operates with an accuracy of 25 µm @ 3 sigma. The placement force can now be reduced to as little as 0.5 N in order to place sensitive components even more gently than before. Further, the new placement head suspension allows significantly easier and faster head changeovers.

To take full advantage of the new model's performance, components are supplied via the new SIPLACE SmartFeeder Xi feeders with faster and more accurate transport systems or the new SIPLACE BulkFeeders X, whose cartridges can hold up to 1.5 million components in bulk.

For electronics manufacturers who already operate SIPLACE TX modules on their lines, spare parts logistics will be mostly unchanged since current and new models are based on identical components (with two exceptions). ASM will switch its global SIPLACE TX shipments to the improved modules in the winter of 2018. The SIPLACE TX is aimed at demanding high-volume manufacturers in Europe, North America, South America, and Asia.

The SMT Solutions Segment of ASM Pacific Technology

Since the acquisition of printing specialist DEK and its integration into ASM Pacific Technology (ASMPT) on July 2, 2014, ASM Assembly Systems has been operating as ASMPT's SMT Solutions segment consisting of the Printing Solutions Division (DEK) and the Placement Solutions Division (SIPLACE).

SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar markets as well as best-in-class SIPLACE SMT placement solutions. Both divisions use the ASMPT organization to let their customers enjoy significant competitive benefits. The SMT Solutions segment of ASMPT shares and expands its expertise with electronics manufacturers and partners all over the world. Its goal is to improve its customers' workflows and use new technologies to advance process integration in the industry.

About ASM Pacific Technology Limited

Founded in 1975, ASMPT is the only company in the world that supplies high-quality equipment for all major steps of the electronics manufacturing process – from carriers to chip bonding, assembly and packaging to surface-mount technology. No other equipment maker comes close to the scope and depth of ASMPT’s process expertise.

The Backend Equipment Segment of ASMPT offers a wide range of products for bonding, molding and trim-and-form processes as well as their integration into complete inline systems for the microelectronics, semiconductor, photonics and optoelectronics industries. The Materials Segment offers a multitude of etched or stamped leadframes and advanced packaging solutions. The SMT Solutions Segment of ASMPT develops and sells best-in-class printers for the SMT, semiconductor and solar markets under the DEK brand name and best-in-class SMT placement solutions under the SIPLACE brand name.

ASMPT has been listed on the Hong Kong Stock Exchange since 1989.

For more information about ASMPT, click here.

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