GOEPEL Launches WLAN Connection for Boundary Scan Controller


Reading time ( words)

GOEPEL electronic’s JTAG/Boundary Scan controller SCANFLEX II Cube gets an optional wireless LAN interface. Previously, the controller had USB 3.0 or LAN interfaces as standard. With the new option, another control interface is now available.

SCANFLEX II Cube is a modular JTAG/Boundary Scan controller. Utilizing state-of-the-art multi-core processors and FPGAs, the user can run all Embedded JTAG Solutions technologies for testing and programming of electronic assemblies. Thanks to the multifunctional architecture, the technologies can be combined flexibly and with high performance on one platform. SCANFLEX II has eight independent, truly parallel Test Access Ports (TAP) for up to 100MHz. This enables the synchronized execution of embedded test, debug and programming operations via Boundary Scan (IEEE 1149.x), processor emulation, chip integrated instruments or the embedded diagnostics method. ´

The WLAN option offers advantages in terms of ease of integration into existing wireless infrastructures and easy use as a resource in a user pool. The user software is SYSTEM CASCON, an integrated platform solution for the generation and execution of embedded functional tests, programming and board test procedures. After linking the controller to the desired SYSTEM CASCON station, all operations can be performed via the WLAN network. The WLAN option can be retrofitted at any time and requires no special software installation.

GOEPEL electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Industrial Function Test
  • Inspection Solutions AOI·AXI·SPI·IVS

For more information, click here.

 

Share

Print


Suggested Items

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

AOI Programs with a Magic Click

12/12/2018 | Jens Kokott and Matthias Muller, Goepel electronic
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.



Copyright © 2019 I-Connect007. All rights reserved.