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PCB assembler Hindley Circuits Ltd has recently secured an ISO 9001:2015 certification after meeting rigorous qualification requirements. As the most up-to-date certification of its kind—and the hardest yet to achieve—the standard focuses around companies' quality management systems.
With robust and well managed systems in place, achieving this certification will allow Hindley Circuits to monitor and continually improve its systems while also ensuring that it is consistently meeting its customers needs to the very highest standards.
Conforming to stringent criteria, the certification demonstrates the company's commitment to adhering to regulatory requirements, providing peace of mind to both its new and existing customer base.
KIC announced that MB (Marybeth) Allen will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, August 23, 2018 at the John Hopkins University/Applied Physics Lab in Laurel, Maryland.
Stephen Las Marias, I-Connect007
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Thilo Sack, Alex Chen, James Huang, and Sam Khoo, CELESTICA INC.
The first three industrial revolutions came about because of mechanization, electricity and IT. Now, with the advent of the Industrial Internet of Things (IIoT) and services making their way into the manufacturing environment, we are seeing the arrival of a fourth industrial revolution, Industry 4.0.