Indium’s Kim Flanagan to Present at SMTA Capital Expo & Tech Forum


Reading time ( words)

Indium Corporation’s Kim Flanagan, technical support engineer, will present at SMTA Capital’s Expo & Tech Forum on August 23 in Laurel, Maryland.

Bottom termination component (BTC) use has increased substantially over the past decade, with today’s assemblies often encompassing various types of BTCs within one assembly. Flanagan’s presentation, Avoiding the Pitfalls of Voiding in PCB Assemblies, tells us how the industry has explored process modifications to assist with achieving the lowest voiding in large ground plane solder joints through optimizing pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profiles. This presentation discusses how IPC’s recommendations for design and implementation of BTCs and impending changes to IPC-7093 can help minimize voiding and ensure robust BTC assemblies.

Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in Physics from Le Moyne College and joined the technical support team in December 2016.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

Supply Chain in Crisis

02/08/2019 | Nolan Johnson, I-Connect007
In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Most Important Feedback

01/09/2019 | Stephen Las Marias, I-Connect007
In our recent I-Connect007 survey, we asked the following question: “What is the most important feedback that you receive after your board is manufactured?” Here are just a few of the replies, edited slightly for clarity.



Copyright © 2019 I-Connect007. All rights reserved.