Indium’s Kim Flanagan to Present at SMTA Capital Expo & Tech Forum


Reading time ( words)

Indium Corporation’s Kim Flanagan, technical support engineer, will present at SMTA Capital’s Expo & Tech Forum on August 23 in Laurel, Maryland.

Bottom termination component (BTC) use has increased substantially over the past decade, with today’s assemblies often encompassing various types of BTCs within one assembly. Flanagan’s presentation, Avoiding the Pitfalls of Voiding in PCB Assemblies, tells us how the industry has explored process modifications to assist with achieving the lowest voiding in large ground plane solder joints through optimizing pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profiles. This presentation discusses how IPC’s recommendations for design and implementation of BTCs and impending changes to IPC-7093 can help minimize voiding and ensure robust BTC assemblies.

Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in Physics from Le Moyne College and joined the technical support team in December 2016.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

Failures and Reliability in Soldering

07/09/2019 | Michael Gouldsmith and Zen Lee, Thermaltronics
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.



Copyright © 2019 I-Connect007. All rights reserved.