Alpha Assembly Solutions to Feature Innovative Solder Tech and Recycling Services at SMTA Monterrey Expo


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature its low temperature solder and void reduction solutions technologies, in addition to its solder debris recycling capabilities at the SMTA Monterrey Conference and Expo taking place on September 12, 2018 at the Hotel Crowne Plaza, Monterrey, Mexico.

Alpha will be promoting ALPHA OM-358 ultra-low voiding paste, a recent addition to Alpha’s Void Reduction Solutions technologies program. Designed for high reliability applications, this paste well suited for automotive, aerospace, LED, and medical customers. “Capable of achieving less than ten percent voiding on bottom terminated components, ALPHA OM-358 provides excellent electrical and thermal performance, increasing production efficiency and reducing the amount of rework,” said Robert Wallace, Regional Marketing Manager for the Americas. “We are pleased to provide a best-in-class paste which exceeds the voiding performance demands of our customers.”

Alpha’s expertise in low-temperature soldering will also be a focus, including its newest low temperature solder paste, ALPHA OM-550. Providing a solution for customers looking for SAC305-type mechanical and thermal reliability, this paste provides efficiencies in both energy and cost while improving BGA mechanical reliability, drop shock performance, and voiding on a variety of package types. During the Expo, Alpha will highlight The Printed Circuit Assembler’s Guide to... Low Temperature Soldering which was recently published and written by several low-temperature solder experts from Alpha.

In addition, Alpha will feature its Recycling Services program. Awarded an export license from SEMARNAT (the Department of Environment and Natural Resources in Mexico) to handle and transport nationalized scrap solder paste, debris, dross and other tin bearing materials, Alpha has expanded its recycling capabilities throughout Mexico. “This license is an important addition to our sustainabilty initiatives at Alpha,“ said Mitch Holtzer, Director of Reclaim Business. “As it increases the positive impact our recycling program can have on the rapidly expanding electronics assembly market in Mexico“.

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here

About Alpha Assembly Solutions

Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.

As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.   

RELATED CONTENT:

Share

Print


Suggested Items

Benefits of Jet Printing Solder Pastes

01/30/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

01/30/2019 | Real Time with...IPC
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.



Copyright © 2019 I-Connect007. All rights reserved.