AIM’s Mehran Maalekian to Present at SMTA International 2018


Reading time ( words)

AIM Solder’s Dr. Mehran Maalekian, research & development manager, will present the white paper “New Pb-Free Solder Alloy for Demanding Applications” at SMTA International 2018, scheduled to take place on October 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois.

Dr. Maalekian will share his extensive knowledge of solder alloys used in harsh service environments such as high-power LED and automotive under-hood applications. Sn/Ag/Cu (SAC) alloys have demonstrated unstable mechanical performance and are not adequately reliable for high thermal stress applications. In this work a novel high reliability SAC base alloy with added alloying and micro-alloying elements, REL22™, is presented. By comparing thermal, mechanical, wetting properties of REL22 against reference SAC, it is explained why REL22 with greater strength and stable creep properties possesses superior thermal fatigue resistance and mechanical properties as compared to SAC305 and other SAC and low silver alloys.

Additionally, AIM will highlight its full line of advanced solder materials, including its high reliability alloys, solder paste, liquid flux and solder alloys. To discover all of AIM’s products and services, visit the company at booth number 408.

About Dr. Mehran Maalekian

Dr. Maalekian is experienced in materials engineering with a focus on physical metallurgy, soldering, modelling in materials engineering, metal forming and thermo-mechanical processes. Dr. Maalekian has received numerous recognitions including the National Sciences and Engineering Research Council of Canada Award, the International Henry Granjon Prize (IIW), and IWS-Sossenheimer Award. He has been awarded the honor of Speaker of Distinction by the Surface Mount Technology Association (SMTA). Dr. Maalekian has published many scientific and technical papers, serves as a reviewer of several scientific journals, and is on the editorial board of “Science and Technology of Welding and Joining.”

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

 

 

Share

Print


Suggested Items

Benefits of Jet Printing Solder Pastes

01/30/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

01/30/2019 | Real Time with...IPC
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.



Copyright © 2019 I-Connect007. All rights reserved.