ZESTRON to Feature Latest Cleaning Technologies at SMTA New England


Reading time ( words)

ZESTRON will be featuring its leading cleaning technologies HYDRON, MPC, and FAST at the SMTA New England Expo and Tech Forum.

HYDRON Technology incorporates water-based, single-phase, cleaning agents, covering a wide range of cleaning applications, such as defluxing of PCBAs, power electronics, advanced packages, and wafers.

MPC, Micro Phase Cleaning, is an innovative water-based cleaning technology that combines the advantages of both solvent and surfactant technologies. ZESTRON’s eco-friendly VIGON cleaning agents are based on MPC Technology and have been specifically formulated for SMT and power electronics as well as MRO and metal cleaning applications.

FAST, Fast Acting Surfactant Technology, is an innovative dynamic surfactant-based cleaning technology with a proprietary mix of newly developed surfactants allowing for quicker removal of a wide variety of the latest lead-free and leaded flux residues. It requires much shorter contact times, fewer active ingredients for the complete removal of contaminants and ensures a longer bath life resulting in reduced process and maintenance costs.

The SMTA New England Expo and Tech Forum will be held at the DCU Center in Worcester, MA on September 12. 

About ZESTRON                                                                                                                            

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. With eight worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please click here.

Share




Suggested Items

The Benefits of Vapor Phase Reflow Soldering

05/03/2023 | Barry Matties, I-Connect007
JB Byers, vice president of technical support services at A-Tek Systems in Longmont, Colorado, recently gave a presentation on vapor phase reflow soldering at the SMTA Boise Expo & Tech Forum. After his presentation, I-Connect007 briefly talked with him about how the process can help reduce voids and lower operating cost.

Coming Clean with KYZEN

04/07/2023 | Andy Shaughnessy, I-Connect007
At the recent SMTA Dallas Expo & Tech Forum, I spoke with Fernando Rueda, manager of the Americas for KYZEN, about the company’s newest technologies and trends he’s seeing in SMT cleaning processes. As Fernando points out, cleaning is now a requirement for most boards, and the cleaning process becomes more challenging as features get smaller and faster. No-clean technology can often make a challenging situation worse.

A Week-long Industry Extravaganza

03/03/2023 | Happy Holden, I-Connect007
We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.