Zestron's pH-Neutral Defluxing Agent to be Featured at SMTA Monterrey


Reading time ( words)

Zestron, a provider of high-precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, will feature VIGON N 680 at the SMTA Monterrey Expo.

VIGON N 680, based on the MPC Technology (Micro Phase Cleaning), is a water-based, pH neutral cleaning agent specifically developed for the use in spray-in-air inline and batch equipment. VIGON N 680 removes a broad range of electronic assembly flux residues with an exceptional ability to penetrate and clean under low standoff components.

The SMTA Monterrey Expo and Tech Forum will be held at the Crowne Plaza in Monterrey, Mexico on September 12. For more information or to register, please click here.

About ZESTRON

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. With eight worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please click here.

Share

Print


Suggested Items

Matt Stevenson on Sunstone Circuits' Current Operations

03/25/2020 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Matt Stevenson, VP of marketing at Sunstone Circuits, who shares an update on the company's current level of business operations under COVID-19 restrictions. Stevenson confirms that Sunstone Circuits is fully operational and classified as an essential business.

Joe Fjelstad Breaks Down His Occam Process

03/04/2020 | I-Connect007 Editorial Team
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.



Copyright © 2020 I-Connect007. All rights reserved.