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Test Research, Inc. (TRI) will take part in SMTA Guadalajara Expo & Tech Forum. The exhibition will be held in Expo Guadalajara, Mexico on November 14-15, 2018.
TRI offers the one stop solution for PCB assembly testing and inspection, which includes 3D solder paste inspection (SPI), 3D automated optical inspection (AOI), 3D CT automated x-ray inspection (AXI), high performance in-circuit testing (ICT) and functional tester (FCT). TRI's portfolio has a wide range of high-end features and advanced functionalities to satisfy the ever-changing Industry.
Uncover your production line's potential with TRI's PCBA test and inspection solutions, and Industry 4.0 data management system, YMS 4.0, yield management system 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
TRI provides the most cost-effective solutions to meet comprehensive range of manufacturing test and inspection requirements, from automatic test and inspection solutions to manufacturing defect analyzers, in-circuit tester and functional tester.
Stephen Las Marias, I-Connect007
Majority of the respondents in our survey answered that reliability is the biggest impact of low-temperature soldering on PCBAs. Issues they highlighted include the strength of the solder joints, "uncooked" solder, insufficient solder, and solder not adhering properly, to name a few. However, they did note that once the process becomes mainstream, proven and an industry standard, they expect low-temperature soldering to result to higher quality PCBAs.
David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.
I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.