MIRTEC Features Award-Winning 3D AOI and SPI Systems at SMTAI 2018


Reading time ( words)

MIRTEC plans to exhibit at SMTA International, scheduled to take place October 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois. The company will premier its award-winning MV-6 OMNI 3D AOI and MS-11e 3D SPI systems booth number 208.

“We at MIRTEC are very excited to present what is unquestionably the inspection industry’s most technologically advanced 3D AOI System at SMTAI 2018”, says Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. The all new MV-6 OMNI 3D AOI machine is configured with MIRTEC’s exclusive OMNI-VISION 3D inspection technology which combines our award winning 15 mega pixel CoaXPress camera technology with MIRTEC’s revolutionary digital tri-frequency moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies. MIRTEC’s proprietary 15 mega pixel CoaXPress camera system is designed and manufactured by MIRTEC for use with our complete product range of inspection equipment. MIRTEC’s Digital Tri-Frequency Moiré Technology, provides true 3D inspection for devices up to 25mm tall using a total of four Programmable Digital Moiré Projectors. This proprietary system yields precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-6 OMNI machines feature four 10 mega pixel side-view cameras in addition to the 15 mega pixel top-down camera. There is little doubt that this new technology will set the standard by which all other inspection equipment will be measured.

MIRTEC2.jpgMIRTEC’s award-winning MS-11e 3D SPI Machine is configured with an exclusive 15 Mega Pixel CoaXPress Camera System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.

The MS-11e uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

MIRTEC’s total quality management system software, INTELLISYS also will be on display at SMTA International. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.

“MIRTEC continues to set new standards within the highly competitive electronics inspection industry”, continued D’Amico. “These revolutionary products provide unprecedented 3D inspection performance and the industry’s lowest cost of ownership, making them an ideal solution for electronics manufacturing companies of all sizes. We look forward to welcoming visitors to our booth #208 during the two-day event.”

About MIRTEC

MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please click here.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.