Alpha to Feature Recycling Services and Low Void Technology at SMTA Orange County Expo


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic assembly materials, will feature its Void Reduction Solutions technologies and solder debris recycling capabilities at the Orange County Expo and Tech Forum taking place on Thursday, November 1 at The Grand in Long Beach, California.

At the Expo, Alpha will be promoting its Void Reduction Solutions (VRS) program, a program designed to help manufacturers meet the demaning void requirements of their customers.  Alpha’s latest ultra-low voiding paste, ALPHA® OM-358 is the latest addition to the VRS tool kit which includes a variety of products and processing solutions. 

ALPHA® OM-358 was engineered for high reliability applications, and well suited for automotive, aerospace, LED, and medical applications. “This paste achieves less than ten percent voiding on all types of bottom terminated components.”, said Robert Wallace, Regional Marketing Manager for the Americas.  “With excellent electrical and thermal performance, ALPHA® OM-358 increases production efficiency and reduces the amount of rework, a significant beneift for our customers.“.

Alpha will also feature its Recycling Services program.  As part of Alpha’s sustainability initiatives, Alpha recycles scrap solder paste, debris, dross, and other tin-bearing materials from manufacturers throughout North America, and recently expanded its recycling capabilities throughout Mexico, having received an export license from SEMARNAT, the Department of Environment and Natural Resources in Mexico, to handle and transport nationalized scap material.  “The recycling market continues to expand throughout the Americas,“ said Mitch Holtzer, Director of Reclaim Business, “Our goal is to make the recycling process simple for manufacturers, allowing recycling to become a realistic and attractive alternative to sending materials to land-fills.“.

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.  For more information, click here.

About Alpha Assembly Solutions

Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.

As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges.  Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services.  For more information, click here.

Share

Print


Suggested Items

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.



Copyright © 2019 I-Connect007. All rights reserved.