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11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.
11/09/2018 | Stephen Las Marias, I-Connect007
Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.
10/16/2018 | Stephen Las Marias, I-Connect007
Viscom AG COO Peter Krippner discusses artificial intelligence (AI) and its impact in the electronics manufacturing industry. He speaks about how AI will change the industry, the challenges in adopting AI, and the state of implementation of AI in electronics manufacturing right now.