New NPL Webinar Titles for 2019


Reading time ( words)

The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research

The team investigate interconnect properties and develop metrological techniques to characterise performance, frequently in multiple domains. Our research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems

Increasing the Performance of Organic PCBs at Higher Temperatures
17th January

Organic Hybrids for Circuit Assemblies – Initial Environmental Testing of a Low Cost Alternative to Ceramic Substrate Based Assemblies
19th March

Evaluation Of Embedded Electronics For Use In Harsh Environments
21st May

Effect of Bias (up to 1000V) on Conductive Anodic Filament (CAF) Failures of Electronic Circuits
16th July

Electrical and Thermal Material Evaluation Using Power Cycling Testing For Power Electronic Applications
17th September

Battery Metrology At NPL – Lithium Ion Cell Characterisation
12th November

Book Your Place Today

Share

Print


Suggested Items

Ross Berntson: Indium Corporation’s Pledge for Safe Resumption Post-COVID

05/22/2020 | Nolan Johnson, I-Connect007
On May 20, Nolan Johnson spoke with Ross Berntson, Indium Corporation’s president and COO, about the company’s response to the COVID-19 outbreak. Berntson details the company's work with a consortium of manufacturing businesses in central New York state, developing a manufacturing pledge to keep people safe and keep factories running. Indium Corporation has been one of the frontrunners in formalizing such procedures and in sharing lessons learned among all the participating companies.

IPC’s Shawn Dubravac: COVID-19 Outbreak Accelerates Industry Shifts Already Under Way

05/21/2020 | Barry Matties, I-Connect007
On May 19, Barry Matties spoke with Shawn Dubravac, chief economist for IPC. While discussing other topics, Matties asked for Dubravac’s perspective on shifts in the market, who observed that the recessionary trend might be behind us; the markets are already showing recovery. Still, it could take a year or so to fully recover.

Happy’s Smart Factory Protocol Primer

04/29/2020 | Happy Holden, I-Connect007
The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article by Happy Holden surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.



Copyright © 2020 I-Connect007. All rights reserved.