New NPL Webinar Titles for 2019


Reading time ( words)

The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research

The team investigate interconnect properties and develop metrological techniques to characterise performance, frequently in multiple domains. Our research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems

Increasing the Performance of Organic PCBs at Higher Temperatures
17th January

Organic Hybrids for Circuit Assemblies – Initial Environmental Testing of a Low Cost Alternative to Ceramic Substrate Based Assemblies
19th March

Evaluation Of Embedded Electronics For Use In Harsh Environments
21st May

Effect of Bias (up to 1000V) on Conductive Anodic Filament (CAF) Failures of Electronic Circuits
16th July

Electrical and Thermal Material Evaluation Using Power Cycling Testing For Power Electronic Applications
17th September

Battery Metrology At NPL – Lithium Ion Cell Characterisation
12th November

Book Your Place Today

Share


Suggested Items

Greatest Challenges in Soldering

12/12/2018 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/14/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.



Copyright © 2018 I-Connect007. All rights reserved.