New NPL Webinar Titles for 2019


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The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research

The team investigate interconnect properties and develop metrological techniques to characterise performance, frequently in multiple domains. Our research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems

Increasing the Performance of Organic PCBs at Higher Temperatures
17th January

Organic Hybrids for Circuit Assemblies – Initial Environmental Testing of a Low Cost Alternative to Ceramic Substrate Based Assemblies
19th March

Evaluation Of Embedded Electronics For Use In Harsh Environments
21st May

Effect of Bias (up to 1000V) on Conductive Anodic Filament (CAF) Failures of Electronic Circuits
16th July

Electrical and Thermal Material Evaluation Using Power Cycling Testing For Power Electronic Applications
17th September

Battery Metrology At NPL – Lithium Ion Cell Characterisation
12th November

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Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Failures and Reliability in Soldering

07/09/2019 | Michael Gouldsmith and Zen Lee, Thermaltronics
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.

Reliability vs. Failure

07/01/2019 | Nolan Johnson, I-Connect007
Summer is officially underway here in the Northern Hemisphere, and just like the temperatures, we’re turning up the heat in this issue and getting technical. Enter “Reliability Man,” the hero who must persevere against all the challenges thrown in his path.



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