Tech Brief Helps Make Critical Thin Film Manufacturing Decision


Reading time ( words)

SemiGen, Inc. an ISO and ITAR registered provider of RF and microwave contract assembly, foundry services, semiconductor devices, and RF supplies has released a technical brief detailing the advantages to RF/microwave circuit designers of manufacturing their circuits using ion beam milling over chemical etching.

This tech brief describes manufacturing thin film circuits using a next-generation anisotropic ion beam milling process that is proving to be the most precise, repeatable, and clean approach over the more random process of traditional material subtraction via chemical etching.

The brief describes experiments conducted by the former Ion Beam Milling, Inc. technical team (now SemiGen) that thoroughly examined the degree of variation in performance of two RF filter circuit designs, one at 12 GHz and the other at 24 GHz. Each were produced via the two processes. The information will provide microwave/millimeter-wave circuit, component, and subsystem engineers a baseline for committing to an intended thin film process and details the key advantages of uniformity and repeatability of trace walls using ion beam milling―particularly at higher frequencies.

The brief makes a strong argument that the ion beam milling process produces such precise and repeatable thin film circuits that it be committed to for all thin film circuits to improve design for manufacturability (DFM) expertise of engineering teams, while improving performance and yields for all products long term. This is especially true for circuit designers who work consistently above 1 GHz. The degree of performance improvement is tied to a variety of factors, including the complexity of the circuit design, feature size, and proximity of trace lines.

About SemiGen  

SemiGen is an RF/microwave solutions company that provides manufacturing services and products to OEMs looking to fill critical voids in their production department and supply chain. Services include hybrid assembly, high frequency testing, up-screening, and foundry options. Products include diodes, semiconductors, and thin film circuits, as well as name brand bonding supplies. Combining decades of experience with a state-of-the-art facility and foundry, they help OEMs become efficient in meeting demands for consistent, reliable delivery of their high performance electronic devices.  

Share

Print


Suggested Items

RTW IPC APEX EXPO 2019: Enabling Complete Automation for Customers

02/13/2019 | Real Time with...IPC
Steve Williams and Saki CEO Norihiro Koike discuss Saki's AOI equipment and complete solution for electronic manufacturers, the industry-leading accuracy of their 3D equipment, and their recent Panasonic IoT certification to provide process data back to the pick-and-place equipment.

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

More Than Inspection: It’s Process Improvement

01/09/2019 | Barry Matties, I-Connect007
Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.



Copyright © 2019 I-Connect007. All rights reserved.