Eutect’s First µ-precise Penetration during Thermode Soldering


Reading time ( words)

As EUTECT put the first force- and temperature-controlled thermode soldering module into operation at an international headlamp manufacturer in 2005, the measurement of the penetration of the thermode was used exclusively as process monitoring and -control. A lot has happened since then. In 2018, EUTECT completed the next further development of the thermode soldering module, which thanks to freely definable parameters, offers new process opportunities.

"A present-day force- and temperature-controlled thermode soldering module must be able to do more than just monitor a process," said Matthias Fehrenbach, CEO of EUTECT GmbH. Since the completion of the last further development of the particular module, all process-relevant parameters can be defined. "This refers in particular to the contact pressure, penetration depth and the temperature profile, which for the first time can now be defined exactly for the process and the needs of the operator. We thereby offer the user far more than a controlled and monitored process. He gets a 100% coordinated and definable process," elaborated Fehrenbach. These further developments lead to the capability of optimizing the cycle time.

The contact pressure of the thermode is 1-60 N. The contact force is displayed and regulated in steps of 0.5 N. This contact pressure can be input via the new visual controller view, according to application and material. A leading and follow-on hold-down device fixes the surfaces to be soldered. "By means of the application-optimised contact pressure and the hold-down devices, which are also new, we can optimise the cycle time up to 70%, depending on the heat sink of the solder points", stressed Fehrenbach. Furthermore, the penetration can be controlled. The accuracy of the penetration control is about 1µm, which is unique in the field of thermode soldering. "The penetration depth that can be freely adjusted in µ ensures a defined solder gap and therefore the most optimal intermetallic phase formation", as Fehrenbach explained the process advantages.

In addition the temperature profile can also be regulated via the new controller and controlled by means of a redundant temperature measurement. The maximum thermode temperature is 450°C. Resistance measurements for monitoring the contact surfaces are also possible. "Furthermore, we have carried out a few more mechanical adaptations", mentioned Fehrenbach. Through the use of smaller, close-fitting Kapton dispensers, it was possible to minimise the overall installation space. The working stroke can be optionally increased up to 50 mm.

About EUTECT

For over 20 years, at EUTECT soldering and connecting systems have been developed, manufactured, installed and programmed as well as commissioned at customers throughout the world. The team of experts from Swabia offers a comprehensive, continually further developed modular construction kit for process solutions in the field of soldering.

From process modules of the most varied of soldering techniques, the optimal modules with regard to process technology and efficiency are selected for the task and combined to tried and tested stand-alone, rotary transfer or inline production concepts for complete solutions.

The EUTECT modular construction kit shows, that with individual modules or free combinations a lean, individual solution of tried and tested modules can often be achieved for the task of a customer product.

For the optimal solution through evaluation or the series-mature production of A-B-C prototypes, there is a technologically comprehensive and innovative EUTECT technology center available.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.