ITW EAE to Showcase Equipment Designed to Meet New Demands of Electronics Manufacturers at IPC APEX EXPO 2019


Reading time ( words)

ITW EAE, the electronic assembly equipment division of ITW will be showcasing MPM, Camalot, Electrovert and Vitronics Soltec equipment at the IPC APEX EXPO, January 29 - 31, 2019 in San Diego, California. The ITW EAE booth (3339) will have Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

ITW EAE has worked with the world’s leading manufacturers in developing equipment that addresses evolving technical challenges such as miniaturization while also meeting the need for higher throughput, yield and performance. Key interface solutions have been developed for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.

“Rapid miniaturization is increasing demand for advances in speed and precision, and we are excited to showcase our strength in these areas,” said Pat O’Brien, ITW EAE Vice President and General Manager. “We also looking forward to continuing our discussions with leading manufacturers on our Industry 4.0 solutions and the collective advantages these capabilities can bring.

Electrovert will be introducing the DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.

About ITW EAE

ITW EAE, a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology.  

Share

Print


Suggested Items

Smart Factory Transitions Are Attainable—With a Plan

06/04/2019 | Nolan Johnson, I-Connect007
In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.

Co-owner Philip Kazmierowicz on New Role as KIC President

05/23/2019 | Nolan Johnson, I-Connect007
KIC is one of the leaders in reflow and thermal process control and smart oven technologies. On March 25, 2019, KIC announced that Philip Kazmierowicz, company co-owner, would take on the position of president. Nolan Johnson took that opportunity to sit down with Kazmierowicz in his Oregon-based R&D lab to discuss KIC's history and his plans for the future of the company.

Ralf Wagenfuehr on Developing Rehm Thermal Systems' RDS Semico Oven

05/01/2019 | Barry Matties, I-Connect007
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems, describes Rehm's new oven—the RDS Semico—and gives an in-depth analysis about how it was designed specifically with the semiconductor industry in mind. Ralf also discusses the semiconductor industry as a whole and outlines the company’s desire to gain market share in Taiwan and Korea in the upcoming year.



Copyright © 2019 I-Connect007. All rights reserved.