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iNEMI will be holding a free workshop next week at IPC APEX EXPO 2019, that will focus on the future of solder materials and how these materials must advance to meet the needs of new products and processes.
This interactive workshop will feature speakers, panel sessions and working groups focused on user needs and materials development.
Keynote speakers include Dr. Carl Bilgrien, Vice President of Innovation at Alpha Assembly Solutions, who will speak on “Technology Roadmap to Meet Next-Generation Assembly Challenges”. Ashay Dani, Director, Materials Technology Development, Assembly Technology Development, at Intel Corp., meanwhile, will speak on "Advanced Packaging Materials – Challenges and Opportunities."
The free workshop will be held on January 31, 2019, from 8:00 a.m. to 2:00 p.m.
Additional speakers include presenters from Indium, HP, Dell, Raytheon, Flex and John Deere. There will also be Q&A panels focused on application-driven materials needs and the challenges of new materials for high-volume assembly.
This workshop is one of the IPC APEX Buzz Sessions. If you don’t register to attend anything else at IPC APEX, you will need an exhibit hall registration to access this workshop. This is available for free via online registration until Saturday, January 26. After January 26, there is a $40 fee for both online and onsite registration. Click here for IPC registration packages.
For further details, please contact Grace O'Malley at firstname.lastname@example.org.