Metcal Robotic Soldering Reduces Risk, Increases Productivity


Reading time ( words)

Metcal has launched the first robotic soldering system with its patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers' soldering process.

"The new CV Robotic Soldering System is the latest example of Metcal's industrial ingenuity," said Mak Manesh, global director, product management, for Metcal. "The system combines Metcal’s patented CV technology with a new graphical user interface."

CV reduces unnecessary dwell time by signalling to the system to move to the next solder joint in the program after a good joint is detected. The Metcal Robotic Soldering System comes with dual cameras, a touchscreen interface and powerful software, enabling easy programming and reduced turnover time.

Importing your Gerber or DXF file, or capturing the image of your printed circuit board, starts the programming process. Control of the system is integrated through the touchscreen interface, enabling users to select your solder joints, control the integrated solder feeder and manage process parameters through a graphical user interface.

About Metcal

Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications.

Share

Print


Suggested Items

Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts

04/22/2020 | I-Connect007
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.

SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

04/14/2020 | Pete Starkey, I-Connect007
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.

This Month in SMT007 Magazine: Exclusive Interview With Burt Rutan, Aerospace Legend

04/03/2020 | I-Connect007 Editorial Team
If you follow advancements in aerospace technologies and expeditions, then you know the name Burt Rutan. Described by Newsweek as “the man responsible for more innovations in modern aviation than any living engineer,” Rutan is a bold visionary with a passion for the advancement of technology, who has designed 46 aircraft throughout his career. Following his IPC APEX EXPO keynote presentation, Rutan stopped by the I-Connect007 booth and shared his thoughts on a wide variety of topics.



Copyright © 2020 I-Connect007. All rights reserved.