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Henkel Corporation has announced the addition of two ultra-low modulus BERGQUIST GAP PAD thermal interface materials (TIMs) to its award-winning line of high compliance thermal management products. BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM have been formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0 W/m-K, respectively.
“As densities increase with electronics miniaturization, maximizing heat dissipation while minimizing assembly stress on delicate components is challenging but essential for reliability,” says Danny Leong, Henkel Global Technology Manager, Thermal Products. “Our new ultra-low modulus TIMs provide this unique performance combination in custom-sized pads with easy handling to enhance process efficiency.”
BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are very soft pads with high conformability to rough or irregular surfaces, effectively filling intricate gaps and allowing for thorough wet out at the interface for maximum thermal transfer. Historically, marrying ultra-low modulus (Shore 000, ASTM D2240) properties with high thermal conductivity has been challenging at best. However, due to the advanced silicone-based resin formulation and filler package, the new BERGQUIST GAP PADs provide exceptionally low assembly stress alongside high thermal control.
Nolan Johnson, I-Connect007
In this follow-up to his recent interview on the Q4 2022 outlook, Shawn DuBravac, IPC chief economist, provides an update on the incoming supply chain for EMS providers. Naturally, this conversation centers on component availability, where the supply crunch is easing, and by how much. It doesn’t seem we’ll be seeing any across-the-board relief for some time to come, but Shawn’s higher-altitude perspective brings insight to your daily planning.
I-Connect007 Editorial Team
There has not been a time in recent memory when the U.S. legislative body is putting as much focus on the microelectronics industries. One bill, the CHIPS Act, was signed into law last year. A new bill introduced this year seeks to allocate funding for printed circuit board fabrication. In this exclusive interview, our team spoke with Travis Kelly, CEO of Isola Group and president of the Printed Circuit Board Association, and U.S. Rep. Blake Moore (R-Utah), who has co-sponsored the bill now before the House. Travis and Blake both express optimism about onshoring domestic production, but the realities of the legislative calendar may pose some risks.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.