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Henkel Corporation has announced the addition of two ultra-low modulus BERGQUIST GAP PAD thermal interface materials (TIMs) to its award-winning line of high compliance thermal management products. BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM have been formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0 W/m-K, respectively.
“As densities increase with electronics miniaturization, maximizing heat dissipation while minimizing assembly stress on delicate components is challenging but essential for reliability,” says Danny Leong, Henkel Global Technology Manager, Thermal Products. “Our new ultra-low modulus TIMs provide this unique performance combination in custom-sized pads with easy handling to enhance process efficiency.”
BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are very soft pads with high conformability to rough or irregular surfaces, effectively filling intricate gaps and allowing for thorough wet out at the interface for maximum thermal transfer. Historically, marrying ultra-low modulus (Shore 000, ASTM D2240) properties with high thermal conductivity has been challenging at best. However, due to the advanced silicone-based resin formulation and filler package, the new BERGQUIST GAP PADs provide exceptionally low assembly stress alongside high thermal control.
Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.
Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.
Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.