SEHO Brings the LeanSelect and GoWave to ElectronTechExpo

Reading time ( words)

SEHO Systems GmbH will exhibit at the ElectronTechExpo, scheduled to take place April 15-17, 2019 in Moscow, Russia. SEHO’s representative Global Engineering will display the LeanSelect and GoWave in Pavilion 3, Hall 13, Booth # B535.

Electronic productions face new manufacturing challenges more and more frequently. In addition to high quality requirements at low production costs, there are an increasing number of product variants and flexible reactions to fluctuation in demand. The SEHO LeanSelect is particularly designed to meet these challenges, featuring the highest flexibility and outstanding return on investment.

The work stations of the LeanSelect are arranged in a counter-clockwise U-shape, thus consistently following the Lean Equipment Design Guidelines. While the entire process is fully automated, loading and unloading of assemblies is done manually on two separate conveyors. This allows processing of up to five carriers at the same time, ensuring highest productivity on a small footprint of only 2.5 m².

Provided with an electro-magnetic soldering unit, the system guarantees perfect and reproducible soldering results. Depending on the application, the LeanSelect can be used for both, flexible miniwave processes and product-specific multiwave soldering processes with high throughput. Quickly exchangeable solder nozzles and multi-nozzle tools ensure short change-over times.

The automatic ultrasonic cleaning function for nozzles is a particular highlight of the system and ensures maximum machine availability. Besides significantly longer lifetime of the solder nozzles, this unique feature provides an absolutely stable soldering process.

Sensors and software tools continuously monitor all process steps, thus providing 100 % automated process control. Depending on the application, even a PowerVision AOI system can be integrated, for solder joint inspection immediately after the soldering process.

The GoWave wave soldering system is a powerful soldering system for those just entering into mass-soldering operations. The system is suited for electronic productions with small or medium-sized volumes and also provides an economic solution for universities, schools and laboratories.

A special feature of this machine is its compact, but performance-oriented design. It therefore allows an economical, automatic wave soldering process at simultaneously low costs.

The design of the GoWave provides the same basic technology found in SEHO’s large wave soldering machines. Offering a fluxing module, an efficient and powerful preheater, an innovative soldering area and an up-to-date control, this system presents the finest soldering technology in its class.



Suggested Items

ICT or Flying Probe: Which Test Is Best for Your Assembly?

07/10/2019 | Russell Poppe, JJS Manufacturing
In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).

Cavity Board SMT Assembly Challenges (Part 1)

06/26/2019 | By Dudi Amir and Brett Grossman, Intel Corp.
The concept behind Component-in-Cavity (CiC) is straightforward. If the tallest component(s) on the motherboard can be placed into a recession created in the motherboard, their thickness relative to the components on the surface of the PCB will thus effectively be reduced. While this concept may be straightforward, its implementation is not. That implementation is the focus of this paper. Read on.

Collaboratively Creating Wearable Medical Products

05/28/2019 | I-Connect007 Editorial Team
Patty Goldman, Barry Matties, and Happy Holden recently spoke with David Moody and Rich Clemente of Lenthor Engineering along with Anthony Flattery and Amit Rushi—their customers at GraftWorx. They discussed a recent project and how they worked together to solve a difficult problem by designing a rigidized flex circuit for their product.

Copyright © 2019 I-Connect007. All rights reserved.