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RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530
March 13, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization.
Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.
To watch the interview, click here.
Suggested Items
Enabling a New Paradigm for Flexible, Point of Need Design and Manufacturing
03/18/2024 | DARPAThe Department of Defense (DOD) needs the flexibility to manufacture critical structures at the time and point of need using locally available materials.
Join The Murray Percival Co. at IPC APEX EXPO 2024
03/15/2024 | Murray Percival CompanyThe Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, is excited to announce their participation in the upcoming IPC APEX EXPO, scheduled for April 9-11 at the Anaheim Convention Center in Anaheim, CA.
ROCKA Solutions Expands into Brazil
03/15/2024 | ROCKA SolutionsROCKA Solutions is thrilled to announce its expansion into Brazil. With a commitment to serving the growing needs of the Brazilian electronics manufacturing market, ROCKA has established new distribution and manufacturing services in the region.
Much Ado About Factory of the Future
03/13/2024 | Chris Jorgensen, IPCFor attendees looking for guidance on modernizing their manufacturing, IPC APEX EXPO 2024 will provide plenty of opportunities to learn about the latest innovations and how to begin applying them in your operations today. When walking the show floor, look for the IPC-CFX flags at vendor booths. These are equipment vendors who know the importance of IPC-CFX for their customers and the industry, and have demonstrated proficiency in IPC-CFX implementations.
DARPA Explores Additive Manufacturing’s Revolutionary Potential for Futuristic Microsystems
03/12/2024 | DARPADARPA played a seminal role in establishing materials science as a discipline. One of the latest disruptive efforts in new materials and applications, the Additive Manufacturing of Microelectronic systEms (AMME) program, seeks to launch microsystems manufacturing far beyond today’s state of the art.