SEHO to Present the Perfect Start into Automated Selective Soldering at SMTConnect


Reading time ( words)

SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will exhibit in Hall 4, Stand 129 at SMTconnect, scheduled to take place May 7-9, 2019, at the NurnbergMesse GmbH in Nuremberg, Germany. The SEHO team will demonstrate the StartSelective, the perfect plug-and-produce selective soldering system, ideal for those just entering automated soldering. The machine is fully equipped to start production immediately: Simply connect, power on and produce.

The StartSelective is thought through down to the last detail, from its ease of operation that does not require special skills to many technical highlights. With a footprint of only 2.5 m², the StartSelective provides maximum quality and reproducibility of soldering results for assemblies up to 508 mm x 508 mm (20" x 20") and an outstanding return on investment. The compact design allows users to integrate the machine in any production island, or to place it as stan-alone system in the corner of the production floor.

While loading and unloading of assemblies is done manually, all process steps are fully automated and monitored. All process-relevant components such as the micro drop jet fluxer, preheat system and maintenance-free electromagnetic soldering unit have successfully been in use for years in other soldering systems from SEHO.

The bottom-side preheat section of the StartSelective is equipped with up-to-date pulsar heaters over the full area, which feature a high energy density and quick reaction time. An additional top-side IR preheating ensures permanent and controlled heat support during long cycles to guarantee constant process conditions.

Another highlight is the soldering area with electromagnetic soldering unit, featuring a 7° soldering angle. It is ideally suited for the use of non-wetted mini-wave nozzles with directed solder flow. The result: An ideal solder peel-off and effective reduction of possible soldering defects, even with difficult board layouts.

The solder nozzles convince with stable and reproducible flow properties, they are maintenance-free and feature a nearly unlimited lifetime, thus avoiding follow-up costs.

Just like the high-volume selective soldering systems from SEHO, the StartSelective is equipped with a complete package for automated process control. The spray jet control in the fluxing area, automatic wave height control and solder level monitoring with automated solder wire supply are only some of the monitoring functions.

The StartSelective is designed for maximum efficiency. Programming is 100 percent offline at any PC workplace so that the machine is always available for production. Simply connect, power on and produce!

For further information, the SEHO team is looking forward to welcoming visitors in hall 4, stand 129.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

Failures and Reliability in Soldering

07/09/2019 | Michael Gouldsmith and Zen Lee, Thermaltronics
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.



Copyright © 2019 I-Connect007. All rights reserved.