SEHO and Heller to Exhibit at Electronics Manufacturing Korea


Reading time ( words)

SEHO Systems GmbH will exhibit at Electronics Manufacturing Korea, scheduled to take place May 15-17, 2019 at the COEX Exhibition Center in Seoul, South Korea. The company will demonstrate the StartSelective and MaxiSelective-HS in the Heller booth #A145.

With a footprint of only 2.5 m², the StartSelective provides maximum quality and reproducibility of soldering results for assemblies up to 20" x 20" and an outstanding return on investment. The StartSelective is thought through down to the last detail, from its compact design, ease of operation that does not require special skills, and many technical highlights.

All process-relevant components such as the micro drop jet fluxer, preheat system and maintenance-free electromagnetic soldering unit have successfully been in use for years in other soldering systems from SEHO. While all process steps are fully automated and monitored, loading and unloading of assemblies is done manually.

SEHO2.jpgThe MaxiSelective-HS is the ideal high quality selective soldering solution for when short cycle times are required. Parallel processes in the fluxing, preheating and soldering area, simultaneous contact of all solder joints with product specific multi-nozzle soldering tools, and the parallel transfer of the assemblies to the next work station make this the ideal system for mass production.

Two basic machine versions of the MaxiSelective-HS can be equipped with four or six stations working in parallel both offer the flexibility needed to meet your individual production requirements. Additional buffer stations at the inlet and outlet of the machine complete this high-speed system. In order to meet complex production challenges or o respond to increasing manufacturing volumes, the MaxiSelective-HS can be expanded with additional modules or it may be combined with other machine types at a later date.

For more information, visit www.seho.de.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

07/15/2019 | Divyakant Kadiwala, Averatek Corporation
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

ICT or Flying Probe: Which Test Is Best for Your Assembly?

07/10/2019 | Russell Poppe, JJS Manufacturing
In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).



Copyright © 2019 I-Connect007. All rights reserved.