Goepel electronic Adds Solder Paste and Placement Inspection


Reading time ( words)

Goepel electronic has enhanced the capabilities of its 3D AOI systems Basic Line · 3D and Vario Line · 3D with the addition of complete solder paste inspection function as well as placement control before the soldering process—making the system more flexible. In addition to the classic AOI tests, these systems can now also be used for inspection tasks to check paste volume, paste height, offset and short circuits.

A large number of EMS service providers are specialists in the high-mix/low-volume segment. Quality assurance of the manufactured products is the top priority and, in addition to flexibility in production, a significant competitive advantage. In order to be able to produce these small and medium quantities economically, the universal use of production machines and inspection systems as well as the early detection of possible defects is an indispensable requirement. In addition to their regular use after soldering the assemblies, AOI systems can also carry out a placement check before soldering if desired, e.g. to detect incorrect components or reverse polarity in advance. This reduces high repair costs or costs due to rejects of faulty assemblies.

Goepel electronic’s 3D AOI systems can perform all 3D inspection functions and solder paste inspection in the inline process with the Vario Line · 3D, as well as stand-alone with manual loading in the Basic Line · 3D. Cost advantages arise in particular when the inline 3D system is combined as an island solution with magazining stations for loading and unloading. Depending on requirements, it can then be used for one or the other application. An additional initial sample inspection or placement inspection can then turn the Vario Line · 3D into a genuine all-in-one system.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.